Key Words:
Water,Cooling,System§TEC1‑12706§Heat,Sink§Thermoelectric,Cooler§Cooler,Module
Note:
1. When the temperature is below -25 ° C, the conduction cooling module will frost.
2. TEC1-12706: One side is the cooling side and the other side is the heat sink side.
3. A heat sink or water-cooled heat sink must be installed on the heat-dissipating side; otherwise the cool sink will be burned.
4. This kit does not include DC power, please prepare it yourself.
Package List:
1 x Thermal Module (Heat Sink)1 x Water Block (Water)1 x TEC1-12706 (Semiconductor Cold Plate)1 x Thermal Grease1 x Fan1 x Aluminum Substrate1 x Screw Mounting Kit
Features:
1、TEC1‑12706 semiconductor cooling plate is used, and the quality is good. 2、A complete sealing structure that isolates moisture from the air. 3、With higher reliability and better working performance. 4、Light weight, small size and easy to install. 5、Excellent DIY kit for electronic enthusiasts in semiconductor cooling applications.
Specification:
Item Type:Semiconductor Cold PlateSemiconductor Cold Plate: TEC1-12706Size:40 x 40 x 3.75mm / 1.57 x 1.57 x 0.15in Internal Resistance: 2.1~2.4ΩHighest Temperature Difference: Above 67°CWorking Current: Imax. = 4~4.6A (Rated 12V)Cooling Power: Up To 70 WattsWorking Environment: -55~83℃Sealing Process: Standard 704 Silicone Rubber Seal All SidesFan: DC 12VConductive module size:60 x 45 x 30mm / 2.36 x 1.77 x 1.18in Water block size:40 x 40 x 12mm / 1.57 x 1.57 x 0.47in Fan size:40 x 40 x 10mm / 1.57 x 1.57 x 0.39in
Product Image: