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Description
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Description
Material
Plastic
Product Attributes
Cream
Package Size
48*48*60(1mm)
Name: Hong Kong repair solder paste
Model: XG-50
Scope of application: mobile phone chip repair computer or home appliance chip patch repair BGA special products chip level repair tools
Applicable models: planting tin for mobile phone repair, BGA planting for electronic industry computers, etc.
Features: The solder joint is white and full, there is no such phenomenon as virtual soldering, false soldering, etc., and it has a strong recombination force with the soldering iron nozzle. It is a fine product in the solder paste, which is a product for repairing mobile phones and precision equipment. The most ideal product for welding on the electronic production line
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Hong Kong repair enamel tin paste
SKU: CJJZGJSD00251-XG 50
$1.84
Warehouse
Model(XG 50)
- XG 50
QTY:
60g
Inventory: --
Estimated Processing Time:
1-3 days for 80% orders
Estimated Delivery Time:
--
Shipping Fee:
0.00
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